Samsung could follow Micron by outsourcing DDR5 and SSD production to third parties to focus on more lucrative HBM and enterprise products — could SanDisk follow suit?
Piecemakers bets edge AI devices will diverge from reliance on HBM — custom-designed memory fuses DRAM stack directly to the processor using hybrid bonding
The current state of Hybrid Bonding in 2026 — TSMC sits at 6 microns and the HBM delay that nobody expected
Hot Chips 2026: Samsung reveals a three-phase HBM roadmap that puts logic and compute inside memory — zHBM ultimately stacks DRAM directly on top of the processor
SK hynix breaks ground on the first HBM plant in the US, bringing key AI component production to the States — says production starts in 2029
Hot Chips 2026: High Bandwidth Flash promises massive bandwidth and capacity, but its usability is extremely limited — new memory format strikes a balance between HBM and NAND flash
Hot Chips 2026: Micron warns HBM wafer penalty is widening with every generation — AI memory uses 3x more silicon than DDR5, company says memory wall is 'getting worse' as prices rise
Memory capacity for all of 2027 has reportedly been booked and sold, with no more DRAM or HBM available
Samsung, SK hynix, and Micron sued over alleged DRAM price fixing amid record memory costs — lawsuit claims coordinated HBM shift was cover to curtail DDR3 and DDR4 production
Sophon PFG-1: a monolithic-3D AI ASIC with 330 GB of on-die DRAM and no HBM
Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration
SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers
Samsung holds desperate final talks with union over 18-day chip factory strike that could cost $20 billion — government-mediated summit seeks to avert industrial action that could hit HBM production
SK hynix places record $8 billion order for ASML EUV lithography machines — should pay for up to 30 EUV machines over two years, serving HBM and advanced DRAM production
SK Hynix to Buy $8 Billion of ASML EUV Equipment: The move comes as SK Hynix seeks to maintain its leadership in the increasingly competitive HBM market
Samsung shows confidence in HBM, portrays next-gen road map
Positron: we don’t need no fancy HBM to compete with Nvidia’s Rubin
SK Hynix's $13B packaging facility promises more HBM for the AI bubble
Micron secures $318 million Taiwanese subsidy for HBM R&D as AI memory arms race intensifies — three-year project aims to develop leading-edge, high-performance memory
SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, $3.9B investment challenges TSMC and reshapes AI supply chains
