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JEDEC developing reduced pin count HBM4 standard to enable higher capacity
Samsung gears up for new factory construction in Pyeongtaek, aims to lead in HBM4
SK Hynix To Build $3.87 Billion Memory Packaging Fab In the US For HBM4 and Beyond
SK hynix to Build $3.87 Billion Memory Packaging Fab in the U.S. for HBM4 and Beyond
HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface
