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Hot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per card — TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed die
d-Matrix presented Raptor, which it calls the first 3D DRAM accelerator for generative inference, showing a TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed DRAM die.
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