Get the latest tech news

Qualcomm Validates HBC Stacked Memory Ahead of 2027 Dragonfly AI250 Sampling


Qualcomm today is announcing that they have completed initial validation on their High Bandwidth Compute technology. The DRAM-stacked-upon-compute architecture moves on to commercialization, with Dragonfly AI250 set to sample in the first half of 2027

None

Get the Android app

Or read this on ServeTheHome

Read more on:

Photo of Qualcomm

Qualcomm

Photo of Memory

Memory

Photo of dragonfly ai250

dragonfly ai250

Related news:

News photo

Nvidia forced to dial back key bandwidth targets on Vera Rubin hardware — tweaks will affect target specifications for memory and interconnect fabric

News photo

Anduril wants to become a laptop maker — drone and defense giant partners with Qualcomm to build new BlueChip devices, all made in the US

News photo

Deadly Intel Fab 28 explosion causes two-week shutdown, to cost $600 million and severely disrupt server chip manufacturing for six months