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TSMC and ASML Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV

lease - HSINCHU, Taiwan, R.O.C. and VELDHOVEN, the Netherlands, September 8, 2026 - On September 7, in advance of the SPIE Bacus Conference, ASML and TSMC formed a collaborative industry initiative to drive the transition to 12-inch photomasks, maximizing the value of High NA EUV lithography.

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