Get the latest tech news

AMD Announces The Ryzen AI 300 Series For Mobile: Zen 5 With RDNA 3.5, and XDNA2 NPU With 50 TOPS

Gavin Bonshor on June 2, 2024 11:01 PM EST During AMD's opening keynote at Computex 2024, company CEO Dr. Lisa Su revealed AMD's latest AI PC-focused chip lineup for the mobile market, the Ryzen AI 300 series.

Under the hood, the new mobile SoC from AMD incorporates not only their new Zen 5 CPU architecture, but also their new RDNA 3.5-based integrated graphics, and the third generation XDNA2-based NPU, the latter of which is rated to deliver 50 TOPS of performance for AI-based workloads. However, it is backed with AMD's latest Zen 5 microarchitecture and all of the IPC gains, the benefits of the TSMC N4 4 nm manufacturing process, and the performance and efficiency uplifts associated with jumping to the next generation of silicon. For adopters of the Ryzen AI 300 chip, this Block FP16 NPU design should theoretically allow it to translate workloads into more efficient performance when using AI-driven applications and effectively enhance overall user experiences in software/tasks from gaming to productivity.

Get the Android app