Get the latest tech news

AMD's Freshly-Baked MI350: An Interview with the Chief Architect

Hello you fine Internet folks,

And so, as you know, it's a long lead time to design hardware, so we were thinking about this years ago and wanted to make sure that MI350 had leadership in FP6 performance. Four of them, one per shader engine, are used for harvesting and we yield those out in order to give us good high-volume manufacturing through TSMC-N3, which is a leading edge technology. And in order to do that, we needed to deliver significant global bandwidth into the compute units for double precision floating point.

Get the Android app