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Apple M5 Chip's Dual-Use Design Will Power Future Macs and AI Servers

Apple will reportedly use a more advanced SoIC packaging technology for its M5 chips, as part of a two-pronged strategy to meet its growing need for...

Apple will reportedly use a more advanced SoIC packaging technology for its M5 chips, as part of a two-pronged strategy to meet its growing need for silicon that can power consumer Macs and enhance the performance of its data centers and future AI tools that rely on the cloud. According to the Economic Daily, Apple has expanded its cooperation with TSMC on a next-generation hybrid SoIC package that additionally combines thermoplastic carbon fiber composite molding technology. Whenever the M5 is adopted, its advanced dual-use design is believed to be a sign of Apple future-proofing its plan to vertically integrate its supply chain for AI functionality across computers, cloud servers, and software.

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