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Biden-Harris administration opens funding competition for up to $1.6 billion to accelerate US semiconductor advanced packaging technologies
Media Contact: Hannah Robinson, hannah.robinson [at] chips.gov (hann
The Biden-Harris Administration’s investments in the NAPMP, including the advanced packaging piloting facility, expected to be announced later this year, will bring innovative and new technologies directly to American manufacturers and consumers - helping achieve the economic and national security goals of the CHIPS and Science Act.” said Secretary of Commerce Gina Raimondo. This funding opportunity spans five R&D areas to address key challenges and technology gaps in advanced packaging detailed in the NAPMP Vision Paper: This multilayered approach targets R&D efforts that are complementary to one another, and will ultimately translate into results that can be integrated collectively and seamlessly into existing advanced packaging manufacturing processes for semiconductors.
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