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Controlling Warpage in Advanced Packages
Mechanical stresses increase with larger sizes and heterogeneous materials.
“Advanced modeling allows companies to simulate the behavior of different materials, thermal dynamics, and mechanical stresses during the assembly process,” said Mike Kelly, vice president of chiplets/FCBGA integration at Amkor. How warpage happens The assembly process includes multiple heating and cooling steps, which induce a certain amount of deformation between adjacent materials with different thermal and mechanical properties. Hung-Chun Yang and colleagues at ASE recently determined that die thickness substantially influences warpage levels measured at multiple steps in an existing process for chip-first fan-out chip on substrate package.
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