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DARPA-Funded Wireless Communication Breakthrough Takes Data Transmission to Another Dimension… Literally. - The Debrief
A breakthrough in the creation of 3D processors using semiconductor technology could reshape the future of wireless communication.
Researchers have made a wireless communication breakthrough by using semiconductor technology to produce three-dimensional processors, which they say are capable of greatly improving methods of transmitting large amounts of data globally. Funded by the Defense Advanced Research Projects Agency (DARPA), the innovation was reported by scientists at the University of Florida, who say it could fundamentally reshape the current wireless communication landscape. Tabrizian’s new approach for multi-band, frequency-agile radio chipsets not only solves a huge manufacturing challenge, but it also allows designers to imagine entirely new communication strategies in an increasingly congested wireless world,” Arnold said in a statement.
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