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Does the future of AI depend on glass?
Glass core-based semiconductor packaging enables unprecedented AI innovations in healthcare for precision and life-saving advancements.
As AI systems advance, their demands push today's solutions to their limits, leading to challenges such as computational power, energy consumption, shrinkage, and warping—especially as manufacturers strive to pack more transistors into ever-smaller devices. Uniquely suited for next-generation semiconductor packaging, glass substrates offer ultra-low flatness for smooth, uniform surfaces—beneficial in processing and product design—and superior thermal and mechanical stability compared to organic materials. The near-zero expansion material ZERODUR®, for example, is a crucial component of leading lithography machines worldwide-- where silicon wafers and exposure masks must be positioned with absolute precision to produce the finest structures for the most potent microchips.
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