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Eliyan raises $60M for chiplet interconnects that speed up AI chips
Eliyan has raised $60 million in funding for its chiplet interconnect technology that speeds up the processing for AI chips.
Request an invite NuLink PHY is proven on advanced process nodes, addresses both Die-to-Die and Die-to-Memory interconnect with its highly efficient performance metrics. “Intensive workloads and cutting-edge applications, including Generative AI and automotive, are driving the demand for more sophisticated semiconductor design and the adoption of chiplet architecture.” “This investment reflects the confidence in our approach to integrating multi-chip architectures that address the critical challenges of high costs, low yield, power consumption, manufacturing complexity, and size limitations,” said Ramin Farjadrad, CEO of Eliyan, in a statement.
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