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Samsung, Amkor, and TI finalize CHIPS deals: 2nm and advanced packaging coming to U.S.
DOC finalizes semiconductor awards totaling nearly $7 billion for Samsung, Texas Instruments and Amkor
TSMC and Amkor link up to bring advanced packaging stateside
U.S. Signs $1.5B in CHIPS Act Agreements With Amkor and SKhynix for Chip Packaging Plants
Amkor Wins $600 Million in US Grants, Loans for Chip Packaging
Amkor to Build $2 Billion Chip Packaging Fab in Arizona Primarily for Apple
Apple announces expanded partnership with Amkor for silicon packaging
