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Ex-Intel CEO Pat Gelsinger gives Japan's new leading-edge chipmaker advice, says Rapidus needs unique tech to compete with TSMC
What could this possibly be?
One exclusive feature that Rapidus intends to offer compared to other major producers like Samsung, Intel, and TSMC is fully automated packaging integrated within the same site as wafer fabrication, which could shorten production timelines. You may like Rapidus is about to start test production of wafers using its 2nm process technology, which relies on gate-all-around transistors and aims to begin high-volume semiconductor manufacturing using this node by 2027. The site will focus on scaling up post-fabrication work, including the development of redistribution layers, 3D packaging processes, assembly design tools, and methods for testing known-good dies (i.e., HBM modules).
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