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First European high-performance chips to be made in Dresden
EU Commission supports German state aid to support 'first of a kind' facility.
ESMC – a joint venture between Taiwan Semiconductor Manufacturing Company (TSMC), Bosch, Infineon, and NXP – is planned to be operating at full capacity by 2029, and is expected to produce 480,000 of chips – used for automotive and industrial applications. The measure aims to strengthen Europe's security of supply, resilience and digital sovereignty in semiconductor technologies, in line with the European Chips Act. In the first 100 days of the incoming Commission, she will also propose a new Clean Industrial Deal, to ensure access to cheap energy and raw materials.
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