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Former SK hynix employee transferred advanced chip packaging technologies to Huawei
Apparently, Huawei even did not ask for specific IP.
A former SK Hynix employee has been formally accused of illegally transferring technologies related to advanced chip packaging used for 3D NAND, HBM, and multi-chiplet assemblies as well as CMOS image sensors to Huawei's HiSilicon division, reports DigiTimes citing the Seoul Central District Prosecutor's office. SK Hynix reportedly clarified that the leaked bonding-related information concerned general wafer-to-wafer processes and not the specific hybrid bonding technique currently being developed or used for commercial products. Investigators discovered that over 11,000 photographs of confidential content were taken, and steps were allegedly made to mask the origin by removing company identifiers such as brand logos and secrecy labels from the images.
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