Get the latest tech news
How fan-on-a-chip tech will cool ultra compact gadgets of the future
As our personal devices get smaller and are expected to do more stuff – whether that's your phone, a smartwatch, or a wearable AI assistant – they also tend to get hotter on the inside. That means it can be hard for them to deliver consistently fast performance, fit more components inside, or avoid…
xMEMS' tiny cooling devices feature a thinfilm piezo layer in the chip that moves a silicon membrane up and down at ultrasonic frequencies (in the hundreds of kilohertz range) when a voltage is applied. The company says this approach offers greater clarity and reduced breakup than traditional compact speaker technology, while also being dust and water resistant. xMEMS is set to begin mass manufacturing its cooling chips early next year, at which point it hopes they will be slotted into smart glasses and other wearable tech.
Or read this on r/tech
