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Intel has processed 30,000 wafers with High-NA EUV chipmaking tool
Two systems in use.
Intel has started using two leading-edge ASML High-NA Twinscan EXE:5000 EUV lithography tools, the company revealed on Monday at an industry conference, Reuters reports. Also, ASML is poised to develop its Twinscan EXE:5000 High-NA EUV tools with feedback provided by engineers from Intel, which could give the American giant an edge over competitors over time. While current-generation Low-NA EUV tools can still achieve an 8nm resolution with double patterning, this lengthens the product cycle and can affect yields.
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