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Intel's First High-Volume Foveros Packaging Facility, Fab 9, Starts Operations
Anton Shilov on January 25, 2024 10:00 AM EST - Posted in - Semiconductors - Intel - EMIB - FOVEROS - Ponte Vecchio - Meteor Lake Intel this week has started production at Fab 9, the company's latest and most advanced chip packaging plant. Joining Intel's growing collection of facilities in New Mexico, Fab 9 is tasked with packaging chips using Intel's Foveros technology, which is currently used to build the company's latest client Core Ultra (Meteor Lake) processors and Data Center Max GPU (Ponte Vecchio) for artificial intelligence (AI) and high-performance computing (HPC) applications.
Joining Intel's growing collection of facilities in New Mexico, Fab 9 is tasked with packaging chips using Intel's Foveros technology, which is currently used to build the company's latest client Core Ultra (Meteor Lake) processors and Data Center Max GPU (Ponte Vecchio) for artificial intelligence (AI) and high-performance computing (HPC) applications. "This cutting-edge technology sets Intel apart and gives our customers real advantages in performance, form factor and flexibility in design applications, all within a resilient supply chain. Congratulations to the New Mexico team, the entire Intel family, our suppliers, and contractor partners who collaborate and relentlessly push the boundaries of packaging innovation."
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