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Intel’s next-gen chip manufacturing process reportedly hits snag after failing crucial tests

Intel’s next-gen chip manufacturing process hits snag after reportedly failing crucial tests. Broadcom found that the technique isn’t quite ready for high-volume production.

The report indicates that Intel sent Broadcom’s silicon wafers, which are the components used to form the base of a semiconductor, through the 18A manufacturing process, which is supposed to increase efficiency. Broadcom was reportedly not happy with the results, suggesting that Intel’s new-fangled manufacturing process isn’t ready for high-volume production. “Intel 18A is powered on, healthy and yielding well, and we remain fully on track to begin high volume manufacturing next year,” a spokesperson told Reuters.

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