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Micron Expands Datacenter DRAM Portfolio with MR-DIMMs
by Ganesh T S on July 16, 2024 9:10 AM EST The compute market has always been hungry for memory bandwidth, particularly for high-performance applications in servers and datacenters. In recent years, the explosion in core counts per socket has further accentuated this need.
It must be noted that some vendors are also using TSV (through-silicon vias) technology to to increase the per-package capacity at standard DDR5 speeds, but this adds additional cost and complexity that are largely absent in the MR-DIMM manufacturing process. For the same memory capacity, the 8800 MT/s MR-DIMM shows a 1.31x speedup based on higher average bandwidth and IPC improvements, along with lower last-level cache miss latency. The higher speed offered by MR-DIMMs also helps in AI inferencing workloads, with Micron and Intel showing a 1.31x inference performance improvement along with reduced time to first token for a Llama 3 8B parameter model.
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