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Micron Kicks Off Production of HBM3E Memory
by Anton Shilov on February 26, 2024 1:00 PM EST Micron Technology on Monday said that it had initiated volume production of its HBM3E memory. The company's HBM3E known good stack dies (KGSDs) will be used for Nvidia's H200 compute GPU for artificial intelligence (AI) and high-performance computing (HPC) applications, which will ship in the second quarter of 2024.
Compared to HBM3, HBM3E increases data transfer rate and peak memory bandwidth by a whopping 44%, which is particularly important for bandwidth-hungry processors like Nvidia's H200. Starting mass production of HBM3E memory ahead of competitors SK Hynix and Samsung is a significant achievement for Micron, which currently holds a 10% market share in the HBM sector. This move is crucial for the company, as it allows Micron to introduce a premium product earlier than its rivals, potentially increasing its revenue and profit margins while gaining a larger market share.
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