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Micron Ships Denser & Faster 276 Layer TLC NAND, Arriving First In Micron 2650 Client SSDs
by Anton Shilov on July 31, 2024 11:15 AM EST Micron on Tuesday announced that the company has begun shipping its 9th Generation (G9) 276 layer TLC NAND. The next generation of NAND from the prolific memory maker, Micron's latest NAND is designed to further push the envelope on TLC NAND performance, offering significant density and performance improvements over its existing NAND technology.
Micron's has not previously used this kind of generational branding for their NAND, which up until now has simply been identified by its layer count (and before the 3D era, its feature size). “Micron G9 NAND is up to 73% denser than competitive technologies in the market today, allowing for more compact and efficient storage solutions that benefit both consumers and businesses.” Micron's G9 276-layer TLC NAND memory is also in qualification with customers in component form, so expect the company's partners to adopt it for their high-end SSDs in the coming quarters.
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