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Microsoft announces its innovative in-chip microfluidic cooling system
AI is hot – literally. The chips that datacenters use to run the latest AI breakthroughs generate much more heat than previous generations of silicon.
There are two ways to handle peaks in demand – install a lot of expensive extra capacity that isn’t used most of the time or run the servers harder, which is called overclocking. That would involve a different microfluidics design using cylindrical pins between the stacked chips, a bit like pillars in a multilevel parking garage, with fluid flowing around them. By demonstrating how new cooling techniques such as microfluidics can be made to work, Microsoft hopes to help pave the way for more efficient and sustainable next-generation chips across the industry, the company said.
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