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New Thermal Interface Material Could Cool Down Energy-Hungry Data Centers
A team led by scientists and engineers at The University of Texas at Austin created a new “thermal interface material” that could organically remove heat from high-powered electronic devices, reducing or even eliminating the need for extensive cooling of data centers and other electronic devices.
A team led by scientists and engineers at The University of Texas at Austin created a new “thermal interface material” that could organically remove heat from high-powered electronic devices, reducing or even eliminating the need for extensive cooling. “That trend isn’t dissipating anytime soon, so it’s critical to develop new ways, like the material we’ve created, for efficient and sustainable cooling of devices operating at kilowatt levels and even higher power.” “This breakthrough brings us closer to achieving the ideal performance predicted by theory, enabling more sustainable cooling solutions for high-power electronics,” said Kai Wu, lead author in Yu’s lab.
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