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Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab

y Anton Shilov on May 24, 2024 4:00 PM EST - Posted in - Semiconductors - Packaging - 2nm - Rapidus To say that the global foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by AI and HPC applications is unprecedented, and with Intel joining the contract chipmaking game, this market segment is once again becoming rather competitive as well.

Ultimately, while the company wants to serve the same clients as TSMC, Samsung, and Intel Foundry, the firm plans to do things almost completely differently than its competitors in a bid to speed up chipmaking from finishing design to getting a working chip out of the fab. "We are very proud of being Japanese," said Henri Richard, general manager and president of Rapidus's subsidiary in the U.S. "[…] I know that some people may be looking at this thinking [that] Japan is known for quality, attention to detail, but not necessarily for speed, or flexibility. With that said, the number of chip designers that are using the most advanced production node at any given time is relatively small – limited to large firms who need first-mover advantage and have the margins to justify taking the risk – so it remains to be seen whether Rapidus's business model becomes successful.

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