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Rapidus Wants to Offer Fully Automated Packaging for 2nm Fab to Cut Chip Lead Times
Shilov on August 13, 2024 8:00 AM EST - Posted in - Semiconductors - 2nm - Rapidus One of the core challenges that Rapidus will face when it kicks off volume production of chips on its 2nm-class process technology in 2027 is lining up customers. With Intel, Samsung, and TSMC all slated to offer their own 2nm-class nodes by that time, Rapidus will need some kind of advantage to attract customers away from its more established rivals.
With Intel, Samsung, and TSMC all slated to offer their own 2nm-class nodes by that time, Rapidus will need some kind of advantage to attract customers away from its more established rivals. But ultimately, Rapidus biggest plan to differentiate itself is by automating the back-end fab processes (chip packaging) to provide significantly faster turnaround times. The company is in discussions with the government to make it easier to raise capital, including potential loan guarantees, and is hopeful that new legislation will assist in this effort.
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