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Report: SK Hynix Mulls Building $4 Billion Advanced Packaging Facility in Indiana
by Anton Shilov on March 26, 2024 7:00 PM EST SK hynix is considering whether to build an advanced packaging facility in Indiana, reports the Wall Street Journal. If the company proceeds with the plan, it intends to invest $4 billion in it and construct one of the world's largest advanced packaging facilities.
The field of advanced packaging – CoWoS, passive silicon interposers, redistribution layers, die-to-die bonding, and other cutting edge technologies – has seen an explosion in demand in the last half-decade. As bandwidth advances with traditional organic packaging are largely played out, chip designers have needed to turn to more complex (and difficult to assemble) technologies in order to wire up an ever larger number of signals at ever-higher transfer rates. Investing in the Indiana facility will be a strategic move by SK hynix to enhance its advanced chip packaging capabilities in general and demonstrating dedication to the U.S. semiconductor industry.
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