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Samsung considers moving chip researchers into production teams

Samsung Electronics is looking to shake up its chip division to buck a disappointing performance, with researchers possibly moving to production teams.

Samsung Electronics’ chip division is planning a reorganization and personnel shake-up as the new semiconductor chief experiments with a fresh organizational structure to stimulate the underperforming business. The R&D unit, also known as Samsung Semiconductor Research, is under the chipmaker’s Device Solutions (DS) division and is responsible for conducting pilot studies for next-generation chips. A team dedicated to developing High Bandwidth Memory (HBM) chips was created the same month under the leadership of Vice President Sohn Young-soo.

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