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Samsung races to beat Intel to market with glass substrates for chips — revolutionary tech boosts processing capabilities.
Samsung teams up with partners to develop glass substrates.
Glass substrates promise to offer substantial benefits for multi-chiplet system-in-package (SiP) designs that are expected to become increasingly popular in the coming years. They offer exceptional flatness, which enhances the depth of focus for lithography, and outstanding dimensional stability for interconnects. Additionally, glass substrates exhibit superior thermal and mechanical stability, enabling them to withstand higher temperatures while making them more durable for datacenter applications.
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