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Samsung Reportedly Developing 3-Layer Stacked Image Sensor for Apple
Samsung is purportedly developing a 3-layer stacked image sensor for Apple, in an effort to compete with Sony, Apple’s long-time sensor supplier.
Exclusive: Samsung is currently developing a "3-layer stacked" image sensor in a PD-TR-Logic configuration for Apple. In July, Kuo stated that Samsung is expected to begin shipping 1/2.6-inch 48MP ultra-wide CMOS image sensors (CIS) to Apple for iPhones as early as 2026, breaking Sony's years-long monopoly on supplying CIS to Apple. If accurate, this move could help Apple diversify its supply chain, reducing reliance on a single supplier and potentially lowering component costs.
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