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Samsung, Amkor, and TI finalize CHIPS deals: 2nm and advanced packaging coming to U.S.
Thousands of new jobs are being created, too.
In addition to two fabs, Samsung will establish a specialized R&D fabrication facility to work on manufacturing process technologies several generations beyond those currently in production. Finally, Samsung's project includes the expansion of its fab in Austin, Texas, to make chips on its FD-SOI process technologies for aerospace, automotive, and defense sectors in the U.S. The new facility will feature over 500,000 square feet of cleanroom space on a 55-acre site to support a variety of packaging solutions such as traditional, 2.5D, and 3D technologies.
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