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SK Hynix Mulls 'Differentiated' HBM Memory Amid AI Frenzy
by Anton Shilov on March 1, 2024 3:30 PM EST SK Hynix and AMD were at the forefront of the memory industry with the first generation of high bandwidth memory (HBM) back in 2013 – 2015, and SK Hynix is still leading this market in terms of share. In a bid to maintain and grow its position, SK Hynix has to adapt to the requirements of its customers, particularly in the AI space, and to do so it's mulling over how to make 'differentiated' HBM products for large customers.
"Developing customer-specific AI memory requires a new approach as the flexibility and scalability of the technology becomes critical," said Hoyoung Son, the head of Advanced Package Development at SK Hynix in the status of a vice president With a 2048-bit interface, many (if not the vast majority) of HBM4 solutions will likely be custom or at least semi-custom based on what we know from official and unofficial information about the upcoming standard. Making differentiated HBM offerings requires sophisticated packaging techniques, including (but certainly not limited to) SK Hynix's Advanced Mass Reflow Molded Underfill (MR-RUF) technology.
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