Get the latest tech news
SK hynix pumps $3.9 billion into first U.S. manufacturing base
SK hynix announced a $3.9 billion investment package to build advanced packaging facilities for AI chips in West Lafayette, Indiana, marking its first U.S. manufacturing base. The company will collaborate with Purdue University.
The announcement was made at an investment agreement ceremony held at Purdue University on Wednesday, local time, with various stakeholders including SK hynix CEO Kwak Noh-jung, Indiana Gov. “We are excited to become the first in the industry to build a state-of-the-art advanced packaging facility for AI products in the United States that will help strengthen supply-chain resilience and develop a local semiconductor ecosystem,” said CEO Kwak. “The site was selected due to Indiana’s resilient manufacturing infrastructure and R&D ecosystem, expert intellectuals in the semiconductor field and the talent pipeline at Purdue University and the strong support provided by the state and local government,” SK hynix said in a release.
Or read this on r/technology
