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SK hynix to Build $3.87 Billion Memory Packaging Fab in the U.S. for HBM4 and Beyond
Anton Shilov on April 5, 2024 7:00 AM EST SK hynix this week announced plans to build its advanced memory packaging facility in West Lafayette, Indiana. The move can be considered as a milestone both for the memory maker and the U.S., as this is the first advanced memory packaging facility in the country and the company's first significant manufacturing operation in America.
"We are excited to become the first in the industry to build a state-of-the-art advanced packaging facility for AI products in the United States that will help strengthen supply-chain resilience and develop a local semiconductor ecosystem," said SK hynix CEO Kwak Noh-Jung. SK hynix intends to work in partnership with Purdue University and Ivy Tech Community College to create training programs and multidisciplinary degree courses aimed at nurturing a skilled workforce and establishing a consistent stream of emerging talent for its advanced memory packaging facility and R&D operations. "SK hynix is the global pioneer and dominant market leader in memory chips for AI," Purdue University President Mung Chiang said.
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