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SK Hynix To Build $3.87 Billion Memory Packaging Fab In the US For HBM4 and Beyond
Longtime Slashdot reader DrunkenTerror shares a report from AnandTech: SK hynix this week announced plans to build its advanced memory packaging facility in West Lafayette, Indiana. The move can be considered as a milestone both for the memory maker and the U.S., as this is the first advanced memory...
Longtime Slashdot reader DrunkenTerror shares a report from AnandTech: SK hynix this week announced plans to build its advanced memory packaging facility in West Lafayette, Indiana. The plant will require SK hynix to invest $3.87 billion, which will make it one of the most advanced semiconductor packaging facilities in the world. Meanwhile, SK hynix held the investment agreement ceremony with representatives from Indiana State, Purdue University, and the U.S. government, which indicates parties financially involved in the project, but this week's event did not disclose whether SK hynix will receive any money from the U.S. government under the CHIPS Act or other funding initiatives.
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