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SK hynix wins up to US$450 mln of U.S. grants for advanced chips facility
(ATTN: RECASTS headline, lead with more info; ADDS details throughout, new photos) SEOUL...
The chipmaker and the U.S. Department of Commerce have signed "a nonbinding preliminary memorandum of terms" to provide up to $450 million in proposed federal incentives under the U.S.' CHIPS and Science Act to establish a high-bandwidth memory (HBM) advanced packaging fabrication and R&D facility, the company said in a release. "We look forward to establishing a new hub for AI technology, creating skilled jobs for Indiana and helping build a more robust, resilient supply chain for the global semiconductor industry," company CEO Kwak Noh-jung said. U.S. Secretary of Commerce Gina Raimondo said the envisioned construction will create around 1,000 new jobs and fill "a critical gap in the U.S. semiconductor supply chain," noting that the act is meant "to supercharge America's global technology leadership," according to her office.
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