Get the latest tech news
Testing for Thermal Issues Becomes More Difficult
Chiplets, exotic materials, and heterogeneous integration are impacting test coverage.
Devices operating at higher frequencies or employing materials like silicon-germanium (SiGe), gallium nitride (GaN), or silicon carbide (SiC) have distinct thermal behaviors at the chip level. The move from a single, global thermal view to a granular, per-block or per-core understanding is key to enabling engineers to isolate localized hotspots, minimize parametric drift, and apply targeted cooling strategies. While high-performance computing (HPC) parts can justify the expense of integrated cooling systems, specialized thermal chucks, or liquid-cooled test heads, other device segments require cost-effective solutions that still ensure temperature stability and repeatability.
Or read this on Hacker News