Get the latest tech news
This 1mm 'fan on a chip' could put active cooling inside ultra-thin gadgets
xMEMS's new micro-cooling chip could bring active cooling to any device.
Based on the same MEMS (Micro-electromechanical systems) technology as the company's upcoming ultrasonic driver inside headphones, the micro-cooling chip could lead to slim devices that are less prone to overheating and capable of better sustained performance. Since it's a solid-state device, there aren't any moving parts like rotors or fins to fail, and its thin design means it can be placed directly atop heat-generating components like APUs and GPUs. Other manufacturers can snag it in the first quarter of 2025. xMEMS' fabrication partners, TSMC and Bosch, can easily switch from building its speakers today to constructing micro-cooling chips tomorrow, Housholder says.
Or read this on Endgadget