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TSMC 2nm Update: N2 In 2025, N2P Loses Backside Power, and NanoFlex Brings Optimal Cells
by Anton Shilov on April 25, 2024 8:30 AM EST - Posted in - Semiconductors - TSMC - 2nm - N2 - Nanosheet - N2P - TSMC Symposium 2024 Taiwan Semiconductor Manufacturing Co. provided several important updates about its upcoming process technologies at its North American Technology Symposium 2024.
At a high level, TSMC's 2 nm plans remain largely unchanged: the company is on track to start volume production of chips on it's first-generation GAAFET N2 node in the second half of 2025, and N2P will succeed N2 in late 2026 – albeit without the previously-announced backside power delivery capabilities. Meanwhile, the whole N2 family will be adding TSMC's new NanoFlex capability, which allows chip designers to mix and match cells from different libraries to optimize performance, power, and area (PPA). TSMC's contemporary N3 fabrication process already supports a similar capability called FinFlex, which also allows designers to use cells from different libraries.
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