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TSMC allowed to proceed with building CoWoS facility after archeological discovery
How much capacity will TSMC have at once?
The big question is whether the company will equip both phases at the same time, but if it proceeds with such a plan, then in a couple of years it will have more capacity for advanced packaging methods like integrated fan-out (InFO) and Chip-on-Wafer-on-Substrate (CoWoS), which is good for the industry as TSMC is struggling to meet demand for packaging. The archaeological site is of significant historical value, dating back between 3,500 to 4,500 years, linked to the ancient corded ware pottery culture. The excavation has uncovered various artifacts, including pottery fragments, ceramic rings, and remnants of ash pits and shell mounds.
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