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TSMC experimenting with rectangular wafers vs. round for more chips per wafer
Rectangular substrates to unlock more power are also being tested by Intel and Samsung
Big semiconductor makers are exploring new methods of chip packaging to place more chipset on each piece of substrate. TSMC is working with equipment and material suppliers on the new method, multiple people with direct knowledge of the matter told Nikkei Asia, though commercialization could take several years. ArrowArtboardCreated with Sketch.ArtboardCreated with Sketch.Title ChevronTitle ChevronIcon FacebookIcon LinkedinIcon Mail ContactPath LayerIcon MailPositive ArrowIcon Print
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