Get the latest tech news
TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026
Anton Shilov on May 21, 2024 11:00 AM EST - Posted in - Semiconductors - TSMC - CoWoS - SoIC - TSMC Symposium 2024 Customer demand for AI and HPC processors is driving a much greater use of advanced packaging technologies, particularly TSMC's chip-on-wafer-on-substrate (CoWoS) services. As things stand, TSMC is just barely meeting the current demand for this packaging method – never mind future demand – which is why last year the company announced plans to more than double CoWoS capacity by the end of 2024.
At its European Technology Symposium last week TSMC announced plans to expand CoWoS capacity at a compound annual growth rate (CAGR) of over 60% till at least 2026. The good news is that the various third-party off-site assembly and testing (OSAT) providers are also expanding their CoWoS-like capacity, so the demand for advanced packing isn't a problem that TSMC is facing (or resolving) on their own. Overall, TSMC itself expects leading-edge SiPs for demanding applications like AI and HPC will adopt both CoWoS and SoIC 3D stacking technologies in the coming years, which is why it needs to increase capacity for both methods to be able to build those highly-complex processors.
Or read this on AnandTech