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TSMC's Roadmap at a Glance: N3X, N2P, A16 Coming in 2025/2026
by Anton Shilov on May 22, 2024 5:30 PM EST As announced last week by TSMC, later this year the company is set to start high-volume manufacturing on its N3P fabrication process, and this will be the company's most advanced node for a while. Next year things will get a bit more interesting as TSMC will have two process technologies that could actually compete against each other when they enter high-volume manufacturing (HVM) in the second half of 2025.
Next year things will get a bit more interesting as TSMC will have two process technologies that could actually compete against each other when they enter high-volume manufacturing (HVM) in the second half of 2025. In the following year TSMC will again offer two nodes that are set to target generally similar smartphone and high-performance computing applications: N2P (performance-enhanced 2nm-class) and A16 (1.6nm-class with backside power delivery). Keeping in mind that A16 features enhanced backside power delivery network, it will likely be the node of choice for performance-minded chip designers.
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