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TSMC's says 1.6nm node to be production ready in late 2026 — roadmap remains on track
No, A16 is not delayed, says TSMC.
(Image credit: TSMC)Indeed, all of these process technologies are slated to be ready for high volume manufacturing (HVM) in late 2026. While, generally, a BSPDN enables higher performance and better power efficiency, 'there is no free lunch' here, as noted by Ken Wang, TSMC's Director of Design Solution Exploration. As for N2P, it enhances performance over typical N2 without adding complexities associated with a backside power delivery, which is optimal for client devices, such as system-on-chips (SoCs) for smartphones and entry-level PCs.
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