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US gov't pushing TSMC and Intel to create joint venture in the US: Report
Intel and TSMC do not comment, though.
Additionally, an operational and competitive fabrication facility could draw major chip designers seeking a stable and geographically secure manufacturing alternative, which would ensure the utilization of the fab. Even minor variations in temperature controls, gas flows, or photomask handling can cause significant drift in line widths, transistor characteristics, and yields, making porting complex, expensive, or financially unfeasible. For obvious reasons, TSMC is hardly interested in porting its advanced nodes to Intel facilities in Ireland and Israel, even as part of a joint venture, as this could create overcapacity for its fabrication technologies.
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