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UT’s Texas Institute for Electronics Awarded $840M To Build a DOD Microelectronics Manufacturing Center, Advance U.S. Semiconductor Industry


AUSTIN, Texas — Seeking to ensure America’s national security and global military leadership, the Defense Advanced Research Project Agency (DARPA) has

Under the agreement, TIE will establish a national open access R&D and prototyping fabrication facility that will enable DOD to create higher performance, lower power, light weight and compact defense systems. “The next generation of high-performing semiconductors these resources will enable through DARPA’s partnership with UT TIE will help not only bolster our defense but also pave the way for the U.S. to reclaim its leadership role in this critical industry, and I look forward to seeing more Texas-led advancements in the years to come.” The scope of work will complement UT’s strengths in AI, robotics, circuit design and novel electronics systems development and will draw on the considerable talent of the Cockrell School of Engineering.

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