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Warpage in wafer-level packaging: causes, modelling, and mitigation strategies
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Outsourced Semiconductor Assembly and Test (OSAT) companies at the back-end-of-line (BEOL) have handled packaging for decades, primarily optimizing for labor costs and manufacturing simplicity without fully considering the potential for technological advancements. Subsequent analysis has shown that using a domain decomposition approach can yield results of similar accuracy to a full finite element calculation for wafer warpage predictions with significant computational cost savings ( Roqueta et al., 2024). To prevent incomplete curing and intrinsic defects common to conventional EMCs, embedding dies within novel thermosetting films together with thermal annealing techniques can help manage residual stresses that contribute to warpage ( Li and Yu, 2022).
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