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xMEMS extends micro cooling fan-on-a-chip tech to AI data centers
xMEMS Labs, a pioneer of MEMS-based chips, announced that its innovative µCooling fan-on-a-chip tech will be expanded to AI data centers.
Originally developed for compact mobile devices, xMEMS µCooling now provides targeted, hyper-localized active cooling for dense, thermally-challenged environments inside 400G, 800G, and 1.6Toptical transceivers — a critical yet underserved category in next-gen AI infrastructure. xMEMS’ monolithic MEMS fan, fabricated in standard silicon processes, pumps a continuous stream ofsilent, vibration-free high velocity air pulses and is the only active cooling solution small and thin enoughto be embedded inside the transceiver module. “As data center interconnect demands scale rapidly with AI workloads, thermal bottlenecks are emergingat the component level — especially in optical modules that are sealed, power-dense, and space-constrained,” said Mike Housholder, vice president of marketing at xMEMS Labs, in a statement.
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